Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING DIE AND MANUFACTURING METHOD USING MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2015/133645
Kind Code:
A1
Abstract:
The mobile-side mold (70) of a molding die (30) comprises a mobile-side sleeve (71) and a mobile-side molding mold unit (75), which is stored inside the mobile-side sleeve (71) and which, together with a fixed-side molding mold (55), forms a molding (10). The mobile-side mold (70) also comprises a projecting mechanism (80), which abuts against a portion of the base end face (75b) of the mobile-side molding mold unit (75) and projects the mobile-side molding mold unit (75) with respect to the mobile-side sleeve (71) from the abutting state toward the fixed-side molding mold (55) so as to project the leading end face (75a) of the mobile-side molding mold unit (75) from the leading end face (71a) of the mobile-side sleeve (71) toward the fixed-side molding mold (55).

Inventors:
TSUBOUCHI ISAO (JP)
Application Number:
PCT/JP2015/056827
Publication Date:
September 11, 2015
Filing Date:
March 09, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OLYMPUS CORP (JP)
International Classes:
B29C45/40; B29C33/44
Domestic Patent References:
WO2010116792A12010-10-14
WO2012043224A12012-04-05
Foreign References:
JP2002178371A2002-06-26
JPH05200806A1993-08-10
JPS58197031A1983-11-16
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
Download PDF: