MOLDING DIE OR MASTER PATTERN FOR ELECTROFORMING EACH HAVING RELEASE LAYER

Title:

MOLDING DIE OR MASTER PATTERN FOR ELECTROFORMING EACH HAVING RELEASE LAYER

Document Type and Number:

WIPO Patent Application WO/2006/070857

Kind Code:

A1

Abstract:

A molding die or master pattern for electroforming characterized by comprising a die or master pattern and a release layer comprising a thin organic film formed on the surface of the die or pattern by bringing the die or pattern into contact with an organic-solvent solution containing a silane surfactant represented by the formula [1]: R_n-Si-X_4-n (1) (wherein R represents an optionally substituted C_1-20 hydrocarbon group, an optionally substituted C_1-20 halogenated hydrocarbon group, a C_1-20 hydrocarbon group containing a connecting group, or C_1-20 halogenated hydrocarbon group containing a connecting group; X represents hydroxy, halogeno, or C_1-6 alkoxy or acyloxy; and n is an integer of 1-3) and a catalyst capable of interacting with the silane surfactant. The release layer is excellent in wearing resistance and release performance.

Inventors:

HIDAKA TOMOYA (JP)
NAKAMOTO NORIFUMI (JP)
FUJITA YOSHITAKA (JP)

Application Number:

PCT/JP2005/024034

Publication Date:

July 06, 2006

Filing Date:

December 28, 2005

Export Citation:

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Assignee:

NIPPON SODA CO (JP)
HIDAKA TOMOYA (JP)
NAKAMOTO NORIFUMI (JP)
FUJITA YOSHITAKA (JP)

International Classes:

B29C33/60; C25D1/22

Foreign References:

JPS63149116A	1988-06-21
JPH08337654A	1996-12-24
JP2000129484A	2000-05-09
JPH05339775A	1993-12-21
JPH04364906A	1992-12-17
US5849369A	1998-12-15

Other References: