Title:
MOLDING DIE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/053732
Kind Code:
A1
Abstract:
Process fluctuation is eliminated for forming a fine shape of a molding die while
shortening a molding cycle time and improving transfer characteristics from
the die to a resin at the same time. A molding die (1) is provided for forming a member,
which is composed of a resin material and has a fine structure, by injection molding.
The molding die is provided with a die main body (2); an insulating layer (4) formed
on the die main body (2); and a surface layer (3), which is a layer for substantially
forming a shape of the fine structure and is formed on the main body (2) through
the insulating layer (4). The surface layer (3) is formed by transfer process.
Inventors:
SEKIHARA, Kanji (Inc. 2970 Ishikawa-machiHachioji-sh, Tokyo 05, 1928505, JP)
Application Number:
JP2007/070540
Publication Date:
May 08, 2008
Filing Date:
October 22, 2007
Export Citation:
Assignee:
Konica Minolta Opto, Inc. (2970, Ishikawa-machi Hachioji-sh, Tokyo 05, 1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 1928505, JP)
International Classes:
B29C45/26; B29C33/38; B29C33/42; B29C45/26; B29C33/38; B29C33/42