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Patent Searching and Data


Title:
MOLDING DIE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/034288
Kind Code:
A1
Abstract:
This molding die is provided with a first die having a through-hole, a second die inserted in the through-hole and capable of moving relative to the first die, and a first punch and second punch each insertable into the through-hole, a cavity for compression-molding a molded object being formed in the through-hole, the cavity being surrounded by the second die and the first punch and second punch, an undercut molding part being formed in the surface of the second die facing the cavity, and the second die being formed so as to be divisible into at least two divisions.

Inventors:
MARUYAMA Tsuneo (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
TAMURA Yoshiki (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
SAKAI Hideo (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
Application Number:
JP2017/029386
Publication Date:
February 22, 2018
Filing Date:
August 15, 2017
Export Citation:
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Assignee:
DIAMET CORPORATION (1-1 Kogane-cho 3-chome, Higashi-ku Niigata-sh, Niigata 40, 〒9508640, JP)
International Classes:
B22F3/035; B22F5/10; B30B11/02
Foreign References:
JPH0285304A1990-03-26
JPH0639596A1994-02-15
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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