Title:
MOLDING DIE AND RESIN MOLDING DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2020/040111
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a molding die that makes the molding area on a workpiece as wide as possible, facilitates air discharge, and prevents molding resin from leaking into unnecessary locations. The solution is to engrave an air vent groove (2j) that is connected to a cavity recess (2g) and serves as a passage for the movement of air or molding resin in a clamper (2d), and to dispose a shut-off pin (2k) for opening and closing the air vent groove (2j) so as to be capable of advancing and retreating within the air vent groove (2j) across the boundary between the outer peripheral end surface of the workpiece (W) and a die clamping surface.
Inventors:
NOMURA YUDAI (JP)
SAITOH TAKASHI (JP)
SAITOH TAKASHI (JP)
Application Number:
PCT/JP2019/032363
Publication Date:
February 27, 2020
Filing Date:
August 20, 2019
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C45/34; B29C45/02; B29C45/14; H01L21/56
Domestic Patent References:
| WO2017010319A1 | 2017-01-19 |
Foreign References:
| JP2017087453A | 2017-05-25 | |||
| JP2017164987A | 2017-09-21 | |||
| JP2016198945A | 2016-12-01 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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