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Title:
MOLDING DIE, RESIN MOLDING DEVICE, AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/203784
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a molding die which can be used to resin-mold a workpiece having a member exposed from a resin package without leakage of resin and without breakage. As a solution, when a workpiece (1) is clamped by a pair of dies, a terminal pin (2c) is inserted into an insertion hole (5f), and an elastic member (6) surrounding the terminal pin (2c) is pressed and crushed by a movable pressing member (7), so that the workpiece (1) is resin-molded while a housing case (5c) limits the outward deformation of the elastic member (6), and the elastic member (6) is deformed to fill a gap between the terminal pin (2c) and the insertion hole (5f).

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Inventors:
IKEDA MASANOBU (JP)
SATO HISASHI (JP)
Application Number:
PCT/JP2016/053340
Publication Date:
December 22, 2016
Filing Date:
February 04, 2016
Export Citation:
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Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C45/17; B29C33/12; B29C33/72; B29C45/14; H01L21/56
Foreign References:
JPH08267472A1996-10-15
JPH11345814A1999-12-14
JP2003282613A2003-10-03
JP2010045315A2010-02-25
JPH11309720A1999-11-09
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
A patent business corporation Watanuki international patent and a trademark office (JP)
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