Title:
MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2011/122057
Kind Code:
A1
Abstract:
Provided is a molding die wherein, even if a component near a nozzle touch portion of a die is changed, etc., deformation in the die can be easily reproduced, and the need for re-alignment can be reduced. Because a sprue bush (65) comprises an adjustment mechanism (65c), if a component such as a locate ring (66) or a sprue bush (65) is changed for preventing stringing during molding or for cleaning the component, after the alignment and during the use of a molding die (40), correction is possible so that the deformation in the die to which the locate ring (66), the sprue bush (65), or the like, is attached can be reproduced after the change of the component in the same way as before. Thereby, after the exchanged component, etc., is attached, the need for re-alignment of the die can be reduced, and a molded product (MP) can be precisely molded after the component is changed.
Inventors:
IZAWA Tatsuya (Inc. 2970, Ishikawa-machi, Hachioji-sh, Tokyo 05, 〒1928505, JP)
Application Number:
JP2011/050323
Publication Date:
October 06, 2011
Filing Date:
January 12, 2011
Export Citation:
Assignee:
Konica Minolta Opto, Inc. (2970, Ishikawa-machi Hachioji-sh, Tokyo 05, 〒1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 〒1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 〒1928505, JP)
International Classes:
B29C45/27; B29C33/30
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Claims:
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