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Patent Searching and Data


Title:
MOLDING FILM
Document Type and Number:
WIPO Patent Application WO/2011/037018
Kind Code:
A1
Abstract:
Provided is a molding film which makes it possible to obtain a laminated article at a low cost without ink flow or lamination irregularities. Further provided is a molded article which uses said film. A layer of a resin having a glass transition temperature of 150ºC or higher is formed between a layer of a thermoplastic resin and a printing layer to obtain the molding film.

Inventors:
UTO, Takayuki (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
宇都孝行 (〒58 滋賀県大津市園山1丁目1番1号 東レ株式会社 滋賀事業場内 Shiga, 〒5208558, JP)
Application Number:
JP2010/065497
Publication Date:
March 31, 2011
Filing Date:
September 09, 2010
Export Citation:
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Assignee:
TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 66, 〒1038666, JP)
東レ株式会社 (〒66 東京都中央区日本橋室町2丁目1番1号 Tokyo, 〒1038666, JP)
UTO, Takayuki (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
International Classes:
B32B27/08; B29C45/14; B32B27/00
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