Title:
MOLDING MATERIAL AND ELECTRICAL COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2003/076477
Kind Code:
A1
Abstract:
A molding material having a metal content of 5ppm or below can be obtained by producing an A-B-A type block copolymer wherein A is a polymer block composed of units of an aromatic vinyl monomer and B is a polymer block composed of units of a conjugated diene monomer, hydrogenating the aromatic rings of the block copolymer resulting from the aromatic vinyl monomer and the unsaturated bonds thereof resulting from the conjugated diene monomer to a degree of at least 90 mole % to obtain a polymer having a weight-average molecular weight of 50000 to 300000 and containing 10 to 60 wt% of hydrogenated conjugated diene monomer units based on the whole of the polymer, and purifying the polymer. This material can give through molding electrical insulators which are lowered in dielectric constant and dielectric loss tangent and are excellent in impact strength and in plate adhesion and smoothness.
Inventors:
HASHIMOTO MASAKAZU (JP)
Application Number:
PCT/JP2003/002911
Publication Date:
September 18, 2003
Filing Date:
March 12, 2003
Export Citation:
Assignee:
ZEON CORP (JP)
HASHIMOTO MASAKAZU (JP)
HASHIMOTO MASAKAZU (JP)
International Classes:
C08F8/04; C08F297/04; C08L53/02; H05K1/03; (IPC1-7): C08F8/04; C08F6/00; C08F297/00; H05K1/03
Foreign References:
| JP2001064319A | 2001-03-13 | |||
| JP2002082202A | 2002-03-22 | |||
| JP2002201213A | 2002-07-19 |
Attorney, Agent or Firm:
Maeda, Hitoshi (Kiriyama Bldg. 1-1 Sarugaku-cho 2-chome Chiyoda-ku, Tokyo, JP)
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