Title:
MOLDING MATERIAL, MOLDED ARTICLE AND PROCESS FOR PRODUCTION THEREOF, AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/078292
Kind Code:
A1
Abstract:
Disclosed are: a molding material having high stiffness (bending elastic modulus), good bending strength, high heat resistance (a high thermal deformation temperature) and excellent moldability and also having good impact resistance (Charpy impact strength); and a molded article. The molding material comprises: a cellulose derivative which contains at least one group that is produced by substituting a hydrogen atom in a hydroxy group contained in a cellulose by a group (A) and at least one group that is produced by substituting a hydrogen atom in a hydroxy group contained in the cellulose by a group (B); and a acrylonitrile-styrene copolymer which contains a rubbery component as a dispersed phase. (A) A hydrocarbon group: -RA. (B) An acyl group: -CO-RB (wherein RB represents a hydrocarbon group).
Inventors:
YOSHITANI TOSHIHIDE
UEHIRA SHIGEKI
UEHIRA SHIGEKI
Application Number:
PCT/JP2010/073247
Publication Date:
June 30, 2011
Filing Date:
December 22, 2010
Export Citation:
Assignee:
FUJIFILM CORP (JP)
YOSHITANI TOSHIHIDE
UEHIRA SHIGEKI
YOSHITANI TOSHIHIDE
UEHIRA SHIGEKI
International Classes:
C08L1/08; C08L55/02
Foreign References:
| JP2005154550A | 2005-06-16 | |||
| JP2004051897A | 2004-02-19 | |||
| JP2003119296A | 2003-04-23 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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