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Patent Searching and Data


Title:
MOLDING METHOD AND MOLDING DEVICE FOR COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/048094
Kind Code:
A1
Abstract:
Provided is a molding method for a composite material for molding a composite material by shaping a layered object including a plurality of layered fiber sheets using a mold and hardening the layered object. The composite material includes a bent part having a bent shape. The mold has a molding surface that molds the composite material, and a recess formed on a part other than the molding surface. The molding method comprises: a step for placing the layered object on the molding surface of the mold; a step for covering the layered object with a tension generation member that generates tension on the layered object during shaping, and placing a part of the tension generation member so as to face the recess; a step for covering, with a coating member, the layered object covered with the tension generation member, and sealing the part between the coating member and the mold in an airtight manner; a step for sucking the atmosphere between the coating member and the mold, drawing a part of the tension generation member into the recess, and shaping the layered object; and a step for molding the composite material by hardening the layered object after shaping.

Inventors:
MURAOKA MIKIO (JP)
TAKAGI KIYOKA (JP)
MATSUYAMA DAIKI (JP)
Application Number:
PCT/JP2023/026025
Publication Date:
March 07, 2024
Filing Date:
July 14, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
UNIV AKITA (JP)
International Classes:
B29C70/44; B29C43/12; B29C43/36; B29C53/06; B29C53/82; B29C70/16; B29C70/56
Foreign References:
JP2019511390A2019-04-25
JP2000176998A2000-06-27
JP2018122523A2018-08-09
JP2020093416A2020-06-18
JP2022113386A2022-08-04
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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