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Title:
MOLDING METHOD AND MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/160084
Kind Code:
A1
Abstract:
This molding method has: a first step for injecting a molten resin (16) to a cavity section (13) of a molding die (1); a second step for plunging, in a state wherein the resin (16) is uncured, a punching pin (2) toward the resin (16) in the cavity section (13), said punching pin having a hollow section (5) opened at an leading edge (2a); and a third step for obtaining a resin-molded product by curing the resin (16).

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Inventors:
OZAKI RYOTA (JP)
SHIMIZU MASAHIKO (JP)
MANO SHOYA (JP)
IKEDA KOSUKE (JP)
Application Number:
PCT/JP2019/005567
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C45/36; B29C33/76
Foreign References:
JPH09141698A1997-06-03
JPH07100879A1995-04-18
JP2007098714A2007-04-19
JP2018026485A2018-02-15
JP2717896B21998-02-25
Other References:
See also references of EP 3725490A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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