Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING METHOD AND MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/160084
Kind Code:
A1
Abstract:
This molding method has: a first step for injecting a molten resin (16) to a cavity section (13) of a molding die (1); a second step for plunging, in a state wherein the resin (16) is uncured, a punching pin (2) toward the resin (16) in the cavity section (13), said punching pin having a hollow section (5) opened at an leading edge (2a); and a third step for obtaining a resin-molded product by curing the resin (16).

More Like This:
JPH071517INJECTION MOLD
Inventors:
OZAKI Ryota (2-3, Marunouchi 3-Chome, Chiyoda-k, Tokyo 32, 〒1008332, JP)
SHIMIZU Masahiko (2-3, Marunouchi 3-Chome, Chiyoda-k, Tokyo 32, 〒1008332, JP)
MANO Shoya (2-3, Marunouchi 3-Chome, Chiyoda-k, Tokyo 32, 〒1008332, JP)
IKEDA Kosuke (2-3, Marunouchi 3-Chome, Chiyoda-k, Tokyo 32, 〒1008332, JP)
Application Number:
JP2019/005567
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3 Marunouchi 3-Chome, Chiyoda-ku Tokyo, 32, 〒1008332, JP)
International Classes:
B29C45/36; B29C33/76
Foreign References:
JPH09141698A1997-06-03
JPH07100879A1995-04-18
JP2007098714A2007-04-19
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Download PDF: