MOLDING AND METHOD FOR MANUFACTURING MOLDING

WIPO Patent Application WO/2018/123171

A1

The present invention provides a molding comprising a first resin housing, a second housing bonded to the first resin housing, and a transparent member held by the second housing, wherein the transparent member is free from condensation or fogging and the bonded part between the first housing and the second housing has a favorable appearance. The present invention also provides a method for manufacturing the molding. The molding comprises the first housing, the second housing bonded to the first housing, and the transparent member held by the second housing. The first housing and the second housing are made up of mutually independent resin compositions with the resin composition containing a polyamide resin that has a half-crystallization time of 10 through 60 seconds and a melting point of 200 through 280°C, and the transparent member has a pencil hardness of 8H or more and a coefficient of linear expansion of 1×10-6 through 9×10-6/°C, where the half-crystallization time represents the time measured by depolarization photometry under the condition that the melting point of the polyamide resin is +20°C, the melt time of the polyamide resin is 5 minutes, and the crystallization bath temperature is 150°C.

OKAMOTO FUMIHITO (JP)

PCT/JP2017/034700

July 05, 2018

September 26, 2017

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MITSUBISHI ENG PLASTICS CORP (JP)

G02B7/02; B29C65/02; B29C65/16; C08L77/00; H05K5/02

JP2010281962A	2010-12-16
JP2008308526A	2008-12-25
JP2005139369A	2005-06-02
JP2016218139A	2016-12-22
JP2011057237A	2011-03-24
JPS4854176A	1973-07-30
JPS442584B1	1969-02-03
JP2014058604A	2014-04-03
JP2010286544A	2010-12-24
JP2008308526A	2008-12-25
JP2014074150A	2014-04-24
JP2005002327A	2005-01-06
JP2011195820A	2011-10-06
JP2011140620A	2011-07-21

See also references of EP 3564723A4

SIKS & CO. (JP)

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