Title:
MOLDING MOLD, MOLDING MOLD MANUFACTURING METHOD, AND REPLICA MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/037918
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a molding mold manufacturing method by which the shape of a fine uneven structure of a wide-region pitch can be sufficiently adjusted to a satisfactory degree. Provided is a molding mold manufacturing method which includes a plasma dry-etching process in which a semiconductor or a metal base material which react to sulfur hexafluoride is disposed in a reactive ion etching device, and a mixed gas of sulfur hexafluoride and oxygen is introduced into the etching device. In the plasma dry-etching process, an oxide is scattered onto the surface of the base material, etching is caused to progress on the surface of the base material using sulfur hexafluoride and with the oxide serving as an etching-prevention mask, and as a result thereof, a fine uneven structure is formed on the surface of the base material. Thereafter, an ion beam is projected onto the fine uneven structure in order to adjust the shape of the projections of the fine uneven structure.
Inventors:
YAMAMOTO KAZUYA (JP)
YAMAMOTO TAKESHI (JP)
YAMAMOTO TAKESHI (JP)
Application Number:
PCT/JP2015/075073
Publication Date:
March 09, 2017
Filing Date:
September 03, 2015
Export Citation:
Assignee:
NALUX CO LTD (JP)
International Classes:
B29C33/38; B29C33/42; G02B1/118; H01L21/302; H01L21/3065
Domestic Patent References:
| WO2007020967A1 | 2007-02-22 |
Foreign References:
| JP2006068926A | 2006-03-16 | |||
| JP2013077617A | 2013-04-25 | |||
| JP2010272801A | 2010-12-02 |
Attorney, Agent or Firm:
FUSHIMI, Naoya (JP)
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