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Patent Searching and Data


Title:
MOLDING MOLD, MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/154775
Kind Code:
A1
Abstract:
This molding mold is characterized by the following: being provided with a first die having a through hole, a second die that is inserted in the through hole and is capable of relative movement with respect to the first die, and a first punch and a second punch that can each be inserted in the through hole; an undercut forming part being provided to the second die; and an object to be molded being compression-molded in a cavity surrounded by an inner side surface of the through hole, the second die, the first punch, and the second punch.

Inventors:
MARUYAMA Tsuneo (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
TAMURA Yoshiki (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
SAKAI Hideo (1-1 Kogane-cho 3-chome, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
Application Number:
JP2017/008504
Publication Date:
September 14, 2017
Filing Date:
March 03, 2017
Export Citation:
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Assignee:
DIAMET CORPORATION (1-1 Kogane-cho 3-chome, Higashi-ku Niigata-sh, Niigata 40, 〒9508640, JP)
International Classes:
B30B11/02; B22F3/02; B22F3/03
Foreign References:
JPS528551B21977-03-10
JPS5943106U1984-03-21
JP2003193113A2003-07-09
JP2004298917A2004-10-28
JPS51149106A1976-12-21
Attorney, Agent or Firm:
SHIGA Masatake et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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