Title:
MOLDING PACKAGING MATERIAL AND BATTERY CASE
Document Type and Number:
WIPO Patent Application WO/2012/133683
Kind Code:
A1
Abstract:
Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat-resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). In the heat-resistant resin of the outside substrate layer (2), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied: formula (I) 500 MPa ≤ MB + TB ≤ 700 MPa; and formula (II) |MB - TB| ≤ 30 MPa.
Inventors:
KURAMOTO TETSUNOBU (JP)
MINAMIBORI YUUJI (JP)
MINAMIBORI YUUJI (JP)
Application Number:
PCT/JP2012/058429
Publication Date:
October 04, 2012
Filing Date:
March 29, 2012
Export Citation:
Assignee:
SHOWA DENKO PACKAGING CO (JP)
KURAMOTO TETSUNOBU (JP)
MINAMIBORI YUUJI (JP)
KURAMOTO TETSUNOBU (JP)
MINAMIBORI YUUJI (JP)
International Classes:
B32B15/085; H01M50/124; B65D65/40; H01M50/119; H01M50/121; H01M50/129; H01M50/133
Foreign References:
| JP2009202390A | 2009-09-10 | |||
| JP2001202928A | 2001-07-27 | |||
| JP2005063685A | 2005-03-10 | |||
| JP2010092703A | 2010-04-22 | |||
| JP2005026152A | 2005-01-27 | |||
| JP2008246849A | 2008-10-16 |
Attorney, Agent or Firm:
SHIMIZU Yoshihito et al. (JP)
Yoshihito Shimizu (JP)
Yoshihito Shimizu (JP)
Download PDF:
Claims:
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