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Patent Searching and Data


Title:
MOLDING SYSTEM, MOLDING METHOD, MATERIAL HOLDING DEVICE, SUBSTRATE, COMPUTER PROGRAM, RECORDING MEDIUM, AND CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/151237
Kind Code:
A1
Abstract:
A molding system according to the present invention is provided with: a support device that supports a substrate having first characteristics; an irradiation device that irradiates the substrate with an energy beam; and a feeding device that feeds a molding material to an irradiation position of the energy beam, wherein at least a portion of the molding material is caused to melt at the irradiation position, then the melted molding material is solidified, and a molded object having second characteristics that are different from the first characteristics is formed on the substrate from the solidified molding material.

Inventors:
UENO, Kazuki (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
SEKIGUCHI, Kei (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
EGAMI, Shigeki (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
Application Number:
JP2019/002948
Publication Date:
August 08, 2019
Filing Date:
January 29, 2019
Export Citation:
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Assignee:
NIKON CORPORATION (15-3, Konan 2-chome Minato-k, Tokyo 90, 〒1086290, JP)
International Classes:
B29C64/245; B33Y10/00; B33Y30/00
Domestic Patent References:
WO2015141032A12015-09-24
Foreign References:
JP2001347572A2001-12-18
JPH08318573A1996-12-03
Attorney, Agent or Firm:
EGAMI, Tatsuo (3rd Floor Oak Building Kyobashi, 16-10, Kyobashi 1-chome, Chuou-k, Tokyo 31, 〒1040031, JP)
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