MOLDING SYSTEM AND MOLDING METHOD - SUMITOMO HEAVY INDUSTRIES

Title:

MOLDING SYSTEM AND MOLDING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/182349

Kind Code:

A1

Abstract:

A molding system comprises a molding device for molding a heated metal material using a molding die, a first scale removal unit for removing scales from a molded article retrieved from the molding die and cooling the molded article, and a machining unit for machining the molded article that has been subjected to scale removal and cooled by the first scale removal unit.

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Inventors:

SAIKA MASAYUKI (JP)
UENO NORIEDA (JP)

Application Number:

PCT/JP2021/008798

Publication Date:

September 16, 2021

Filing Date:

March 05, 2021

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Assignee:

SUMITOMO HEAVY INDUSTRIES (JP)

International Classes:

B23P23/04; B21D26/035; B23P25/00; B24C1/00; B24C11/00

Foreign References:

JP2013046916A	2013-03-07
JP2016022482A	2016-02-08
JP2017536474A	2017-12-07

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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