Title:
MOLDING SYSTEM WITH MOVABLE MOLD MODULES
Document Type and Number:
WIPO Patent Application WO2002040196
Kind Code:
A3
Abstract:
A molding system (10) provides a movable mold module (16) which includes movable tie rods (25) which are extendable and retractable with respect to the movable mold module. The tie rods are movable to be removed from a gap between a fixed platen (18) and a movable platen (22) when the platens are separated. The movable mold module is movable along a base (12) to move the movable platen and tie rods relative to the fixed platen, while the tie rods are further movable relative to the movable mold module. The fixed platen may be rotatable relative to the base to allow booking of the fixed platen for access thereto, and may include two or more platens for simultaneous molding of additional products while one of the platens is booked away from the movable mold module. Two or more molding modules may also be provided around a rotatable platen support which includes multiple platens.
Inventors:
AREND DONALD P (US)
Application Number:
PCT/US2001/048467
Publication Date:
August 22, 2002
Filing Date:
October 30, 2001
Export Citation:
Assignee:
AREND DONALD P (US)
International Classes:
B22D17/00; B22D17/26; B29C45/04; B29C45/16; B29C45/17; B29C45/67; B29C45/07; (IPC1-7): B29C45/04; B29C45/64
Foreign References:
| US6120722A | 2000-09-19 | |||
| US3951579A | 1976-04-20 | |||
| US3465387A | 1969-09-09 | |||
| US5417913A | 1995-05-23 | |||
| US4439133A | 1984-03-27 | |||
| US5817345A | 1998-10-06 | |||
| US4836767A | 1989-06-06 |
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