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Patent Searching and Data


Title:
MOLTEN RESIN SUPPLY METHOD AND MOLTEN RESIN SUPPLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/105464
Kind Code:
A1
Abstract:
It is possible to stably operate a molten resin supply device for a long time without causing adhesion of a volatile component of the molten resin to convey means. An extrusion unit (4) of an extruder of the molten resin supply device of a compression molding device discharges the molten resin (11) from an extrusion opening (35c) of an extrusion nozzle (30). An air injection nozzle (35) for injecting a cooling gas is arranged on an outer circumference of the extrusion nozzle (30). The air injection nozzle (35) is directed toward the surface of the molten resin (11) extruded from the extrusion opening (35c) so as to cool the surface of the molten resin (11) by the cooling gas.

Inventors:
KAWAGUCHI KIYOSHI (JP)
SASAKI MASAYUKI (JP)
YONESATO JUN (JP)
HASHIMOTO HIROYUKI (JP)
Application Number:
PCT/JP2007/053460
Publication Date:
September 20, 2007
Filing Date:
February 20, 2007
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD (JP)
KAWAGUCHI KIYOSHI (JP)
SASAKI MASAYUKI (JP)
YONESATO JUN (JP)
HASHIMOTO HIROYUKI (JP)
International Classes:
B29C43/34; B29B11/10; B29C31/04; B29C43/08; B29C48/06; B29C48/355; B29C48/12; B29K67/00
Domestic Patent References:
WO2004067251A12004-08-12
Foreign References:
JP2004276372A2004-10-07
JPH06198665A1994-07-19
JP3674337B22005-07-20
Other References:
See also references of EP 1990171A4
Attorney, Agent or Firm:
ONO, Hisazumi et al. (1-21 Nishi-shimbashi 1-chom, Minato-ku Tokyo 03, JP)
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