Title:
MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) COOLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/190628
Kind Code:
A3
Abstract:
A cooling structure having a heat generating electric component, a heat spreader comprising thermally anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the heat generating electric component; and a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane..
Inventors:
TRULLI SUSAN (US)
GUPTA ANURAG (US)
GUPTA ANURAG (US)
Application Number:
PCT/US2019/016282
Publication Date:
January 09, 2020
Filing Date:
February 01, 2019
Export Citation:
Assignee:
RAYTHEON CO (US)
International Classes:
H01L23/373; F28F21/02; H01L23/66
Foreign References:
| US6075701A | 2000-06-13 | |||
| JP2001267441A | 2001-09-28 | |||
| US20100177796A1 | 2010-07-15 | |||
| EP2454551A1 | 2012-05-23 |
Attorney, Agent or Firm:
MOFFORD, Donald, F. et al. (US)
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