Title:
MONOLITHIC PACKAGING STRUCTURE HAVING TWO METAL PLATES AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/010837
Kind Code:
A1
Abstract:
A monolithic packaging structure having two metal plates and a packaging method. The structure comprises: a circuit layer (40); at least one first EMI layer (30), electrically connected to and located on the circuit layer and forming at least one cavity together with the circuit layer; a solder mask layer (70), disposed outside of the cavity and beneath the circuit layer, the solder mask layer being provided with a plurality of openings (701); an injection hole (13) disposed at a periphery of the monolithic packaging structure having two metal plates and being in communication with the inside of the cavity; a chip (50) located in the cavity; solder balls (80) implanted in the openings of the solder mask layer to be in communication with the circuit layer, and an injection molding material (60) for filling the cavity and the injection hole. The present invention uses two metal plates for packaging to achieve EMI shielding without requiring a conventional mold having a cavity for plastic encapsulation packaging, saving manufacturing costs.
Inventors:
LIU KAI (CN)
LIANG ZHIZHONG (CN)
WANG YAQIN (CN)
LIANG ZHIZHONG (CN)
WANG YAQIN (CN)
Application Number:
PCT/CN2019/072853
Publication Date:
January 16, 2020
Filing Date:
January 23, 2019
Export Citation:
Assignee:
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD (CN)
International Classes:
H01L21/56; H01L23/552
Foreign References:
| CN108695170A | 2018-10-23 | |||
| CN104520978A | 2015-04-15 | |||
| CN102082103A | 2011-06-01 | |||
| CN106816388A | 2017-06-09 | |||
| JPH08250533A | 1996-09-27 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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