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Patent Searching and Data


Title:
MONOMER MIXTURE AND CURABLE COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2019/021934
Kind Code:
A1
Abstract:
Provided is a monomer mixture which is quickly cured even in the presence of oxygen to form a cured product having a high hardness and excellent adhesion to metal and glass. This monomer mixture according to the present invention comprises two or more cationically polymerizable monomers, wherein the monomer mixture contains, as the cationically polymerizable monomers, 10 wt% or more of a compound having at least a hydroxy group and at least one cationically polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group, per molecule, with respect to the entire amount of the monomer mixture, and 5 wt% or more of a compound represented by formula (b) (in the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group, or an s-valent group in which two or more straight-chain or branched saturated aliphatic hydrocarbon groups are bonded together by an ether bond, and s represents an integer of 2 or more) with respect to the entire amount of the monomer mixture.

Inventors:
MIZUTA, Tomoya (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
INOUE, Keizo (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
Application Number:
JP2018/027112
Publication Date:
January 31, 2019
Filing Date:
July 19, 2018
Export Citation:
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Assignee:
DAICEL CORPORATION (3-1 Ofuka-cho, Kita-ku Osaka-sh, Osaka 11, 〒5300011, JP)
International Classes:
C08G59/20; B29C64/112; B41J2/01; B41M5/00; C08G65/18; C09D4/00; C09D7/40; C09D7/63; C09D11/30; C09D163/00; C09J4/00; C09J11/06; C09J163/00
Domestic Patent References:
WO2017110951A12017-06-29
WO2016158522A12016-10-06
WO2015005211A12015-01-15
WO2014171141A12014-10-23
Foreign References:
JP2005154738A2005-06-16
JP2009227804A2009-10-08
JPH10158385A1998-06-16
JP2001089743A2001-04-03
Attorney, Agent or Firm:
GOTO & CO. (2-18, Kobai-cho Kita-ku, Osaka-sh, Osaka 38, 〒5300038, JP)
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