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Patent Searching and Data


Title:
MOTIF-ARRAYING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/150990
Kind Code:
A2
Abstract:
The present invention relates to a motif-arraying apparatus for arraying motifs such as a hot fix or the like in mounting grooves formed in a mold plate. The present invention provides a motif-arraying apparatus comprising a shaking member for loading motifs in the mounting grooves formed in the mold plate, wherein said shaking member includes a vertical board and a horizontal board coupled to an edge thereof, and a plurality of shaking knives coupled to the bottom surface of the vertical board at a predetermined interval. Thus, the apparatus of the present invention not only enables motifs to be correctly arrayed in the mounting grooves formed in the mold plate in a quick and easy manner, but also enables a motif inserted in a wrong direction to be removed from the mounting groove and correctly arrayed, thereby improving productivity, minimizing defects, and reducing costs.

Inventors:
HONG, Duk-haui (Hangbokhan-maeul, 550-3 Sang-dong,,Wonmi-gu, Bucheon-si, Gyeonggi-do 420-030, 420-030, KR)
Application Number:
KR2010/003630
Publication Date:
December 29, 2010
Filing Date:
June 07, 2010
Export Citation:
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Assignee:
HONG, Duk-haui (Hangbokhan-maeul, 550-3 Sang-dong,,Wonmi-gu, Bucheon-si, Gyeonggi-do 420-030, 420-030, KR)
International Classes:
D06Q1/10; D06Q1/00; D06Q1/12
Attorney, Agent or Firm:
KIM, Dong-sub (Youeun-Building 902, 464-3 Sang-dong, Wonmi-gu, Bucheon-si, Gyeonggi-do 420-816, 420-816, KR)
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