MOULD INSERT STRUCTURE

WIPO Patent Application WO/2019/010853

A1

Disclosed is a mould insert structure (1) used in a mould. The mould insert structure (1) comprises a head component (2) and a bottom component (3) movably connected to each other, wherein the head component (2) comprises a first bottom face (41) and a second bottom face (42) parallel to each other, and a first matching face (43) for connecting the first bottom face (41) and the second bottom face (42); the bottom component (3) comprises a first surface (31) and a second surface (32) parallel to each other, and a second matching face (33) for connecting the first surface (31) and the second surface (32); the first bottom face (41) is adhered to the first surface (31), and the second bottom face (42) is adhered to the second surface (32); and the first matching face (43) is opposite the second matching face (33), and there is a gap between the two matching faces. The mould insert structure (1) uses the design of double-section mould inserts and a gap fit between the first matching face (43) and the second matching face (33), and when the head component (2) is impacted or pressed by an external force, the head component (2) is capable of slightly moving and rotating relative to the bottom component (3), so as to realise the purpose of automatic adjustment, and buffering and damping the force.

TANG WANGCHUN (CN)
WANG HAO (CN)
LI JINWEI (CN)
ZHANG SHIJIE (CN)

PCT/CN2017/106185

January 17, 2019

October 13, 2017

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JINCHENG FUTAIHUA PREC ELECTRONICS CO LTD (CN)

B29C33/76; B29C45/26

CN102794865A	2012-11-28
CN206306379U	2017-07-07
CN106313437A	2017-01-11
EP1777054B1	2010-01-06

SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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