Title:
MOULD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2011/122023
Kind Code:
A1
Abstract:
Provided is a mould release film that has embedding characteristics superior to previous PBT-type mould release films while preventing clinging between the circuit exposure film of a mould release layer and a cover lay (CL) film and between mould release layers, when the CL film is adhered to the circuit exposure film. The disclosed mould release film (100) is provided with a release layer (110) that includes, at least, a polybutylene terephthalate homopolymer (A) and a polybutylene terephthalate (PBT)/polytetramethylene glycol (PTMG) copolymer (B).
Inventors:
TANIGUCHI, Hirohito (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
JP2011/001910
Publication Date:
October 06, 2011
Filing Date:
March 30, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
International Classes:
B32B27/36; B32B27/00; H05K3/28
Attorney, Agent or Firm:
CREIA IP ATTORNEYS (Dojima Building, 2-6-8 Nishitenma, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
Claims:
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