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Patent Searching and Data


Title:
MOULDING DEVICE AND MOULDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/046887
Kind Code:
A1
Abstract:
The lens moulding device (100) of the present invention includes a mould (1) with a transfer surface (1a), another mould (2) with a transfer surface (2a), heating devices (3a, 3b) for heat-curing a resin material supplied to transfer surface (1a) and pressed against transfer surface (2a), a pressure control unit (6) for controlling the application of pressure to the resin material by a support device (4), and a direct current power supply (7) for applying voltage between the moulds (1, 2) to form an electric field.

Inventors:
NAKAHASHI TAKAHIRO
HANATO HIROYUKI
Application Number:
PCT/JP2012/068633
Publication Date:
April 04, 2013
Filing Date:
July 23, 2012
Export Citation:
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Assignee:
SHARP KK (JP)
NAKAHASHI TAKAHIRO
HANATO HIROYUKI
International Classes:
B29C39/22; B29C39/10; B29C39/40; B29C39/42; B29L11/00
Domestic Patent References:
WO2010119726A12010-10-21
Foreign References:
JP2005527974A2005-09-15
JP2011073300A2011-04-14
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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