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Title:
MOULDING DIE, OPTICAL ELEMENT, AND METHOD FOR MANUFACTURING OPTICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2011/122090
Kind Code:
A1
Abstract:
Resistance to mould release caused by resin contraction produced by cooling solidification during injection moulding can be suppressed, even in a comparatively deep range in which the value (Y/X) of the vertical/horizontal ratio of the step shapes of, for example, a three-wavelength-compatible optical element is 0.50 ≤ maximum value of (Y/X) ≤ 1.0, by performing mould release in which a first optical transfer face (11A) having step shapes (13A, 15A) that form a diffraction structure is released from a plastic lens (PL) before a second optical transfer face (21A) is released when injection moulding the plastic lens (PL). The plastic lens (PL) can therefore be smoothly released from a fixed mould (10) with substantially no resistance even in the case of an optical element that has a microstructure having deep steps therein, thereby making it possible to prevent deformation of the steps, namely the micro-shapes, of the diffraction structure of the plastic lens (PL).

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Inventors:
SHIMIZU TSUTOMU (JP)
FUJI KENTA (JP)
Application Number:
PCT/JP2011/051733
Publication Date:
October 06, 2011
Filing Date:
January 28, 2011
Export Citation:
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Assignee:
KONICA MINOLTA OPTO INC (JP)
SHIMIZU TSUTOMU (JP)
FUJI KENTA (JP)
International Classes:
B29C45/26; B29C33/42; G02B3/00; G02B5/18; B29L11/00
Domestic Patent References:
WO2009154072A12009-12-23
WO2009084377A12009-07-09
Foreign References:
JP2010044861A2010-02-25
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Claims: