Title:
MOUNTING BOARD CAPABLE OF EVALUATING WIRING PATTERN CHARACTERISTICS
Document Type and Number:
WIPO Patent Application WO/2007/063949
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a mounting board capable of evaluating wiring pattern
characteristics, by which characteristics to a high frequency signal or a high
speed pulse signal of a wiring pattern on the mounting board can be previously
evaluated at a step prior to manufacturing substrates in mass-production. [MEANS
FOR SOLVING PROBLEMS] A board main body (1) is provided with a test pattern (2)
having various wiring patterns as element patterns, and a testing IC chip (3)
which detects a detection signal by transmitting a high frequency and/or high
speed pulse signal to the test pattern (2). Since the testing IC chip (3) outputs
a detection signal and/or test results based on the detection to the external,
a specific manufacturing accuracy of the wiring pattern to the high frequency
or the high speed pulse signal can be detected as digital data. Thus, the characteristic
evaluation of the wiring pattern can be highly accurately and easily performed
by the board itself, under the same conditions as those in the mounting status
of the mass-produced board.
More Like This:
| JPH05282396 | LOGICAL SIMULATION-SYSTEM |
| JP2000164656 | HOLDER FOR BURN-IN OF WAFER |
| JP2004233246 | TEST SYSTEM OF SEMICONDUCTOR DEVICE |
Inventors:
TOMOKAGE HAJIME (JP)
Application Number:
PCT/JP2006/323960
Publication Date:
June 07, 2007
Filing Date:
November 30, 2006
Export Citation:
Assignee:
FUKUOKA INDUSTRY SCIENCE & TEC (JP)
TOMOKAGE HAJIME (JP)
TOMOKAGE HAJIME (JP)
International Classes:
G01R31/28; H05K3/00; H05K1/02
Foreign References:
| JPH0333665A | 1991-02-13 | |||
| JP2003050256A | 2003-02-21 | |||
| JPH04179183A | 1992-06-25 |
Attorney, Agent or Firm:
HIRAI, Yasuo (Hakataekimae 2-chome Hakata-k, Fukuoka-shi Fukuoka 11, JP)
Download PDF: