Title:
MOUNTING BOARD MANUFACTURING DEVICE, AND MOUNTING BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/088594
Kind Code:
A1
Abstract:
A driver mounting device 40 is provided with: a crimp mechanism 50 for crimping drivers 21 all at once that are respectively mounted with respect to terminal portions 23, 24 of a plurality of bonded boards 11ab, 11ab, each of the bonded board 11ab comprising a CF board 11a bonded to an array board 11b having the terminal portions 23, 24 with the terminal portions 23, 24 exposed, the crimp mechanism 50 including a driver-side crimp portion 51 and a board-side crimp portion 52; and a plurality of board holding portions 41, 41 respectively holding each of the plurality of bonded boards 11ab, 11ab, the plurality of board holding portions 41, 41 being installed in a mutually independently movable manner so as to position the bonded board 11ab being retained with respect to the driver-side crimp portion 51.
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Inventors:
YAMAGUCHI KATSUHIRO
NAKATA NOBUHIRO
TAKAHARA TOMOKI
MASUDA YUKINORI
NAKATA NOBUHIRO
TAKAHARA TOMOKI
MASUDA YUKINORI
Application Number:
PCT/JP2015/082831
Publication Date:
June 09, 2016
Filing Date:
November 24, 2015
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G02F1/13; H05K3/32; G02F1/1345; H01L21/603; H05K13/04
Domestic Patent References:
| WO2013141388A1 | 2013-09-26 | |||
| WO2005071734A1 | 2005-08-04 |
Foreign References:
| JP2008251790A | 2008-10-16 | |||
| JP2005129753A | 2005-05-19 | |||
| JP2003059975A | 2003-02-28 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
Patent business corporation dawn joint patent firm (JP)
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