Title:
MOUNTING BOARD MANUFACTURING DEVICE AND MOUNTING BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/114206
Kind Code:
A1
Abstract:
A mounting board manufacturing device is characterized by comprising: a first FPC-side compression bonding unit 51 that performs thermal compression bonding of a first mounted component group 31 including a one-end side mounted component which is, from among a plurality of flexible substrates 13 arranged on an array substrate 11B, a flexible substrate 13 disposed at one end, in the arrangement direction, of the plurality of flexible substrates 13, onto the array substrate 11B by heating as well as pressing the first mounted component group; and a second FPC-side compression bonding unit 52 that is disposed adjacent to the first FPC-side compression bonding unit 51, in the arrangement direction, and that performs thermal compression bonding of a second mounted component group 32 comprising all of the flexible substrates 13 among the plurality of flexible substrates 13 other than the first mounted component group 31, onto the array substrate 11B by heating as well as pressing the second mounted component group.
Inventors:
YAMAGUCHI KATSUHIRO
NAKATA NOBUHIRO
MASUDA YUKINORI
TAKAHARA TOMOKI
NAKATA NOBUHIRO
MASUDA YUKINORI
TAKAHARA TOMOKI
Application Number:
PCT/JP2016/050297
Publication Date:
July 21, 2016
Filing Date:
January 07, 2016
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H05K3/36; H01L21/603
Domestic Patent References:
| WO2011001692A1 | 2011-01-06 |
Foreign References:
| JP2005317784A | 2005-11-10 | |||
| JP2007208277A | 2007-08-16 | |||
| JP2002313852A | 2002-10-25 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
Patent business corporation dawn joint patent firm (JP)
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