Title:
MOUNTING BOARD PRODUCTION SYSTEM, COMPONENT MOUNTING SYSTEM, MOUNTING BOARD PRODUCTION METHOD, AND COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/059606
Kind Code:
A1
Abstract:
During mounting board production in this mounting board production system, solder sections are formed on a mounting board and components are mounted to a board for which inspection of solder sections is complete. In addition, component mounting misalignment is measured regarding boards having components mounted thereto and component mounting misalignment data is output. A plurality of pieces of component mounting misalignment data are used as a basis to perform calculation of calibration data for correcting component mounting misalignment resulting from variation in a component mounting device over time. When a component is mounted to a solder section for which an unsatisfactory inspection result was determined during the inspection of solder sections, the component mounting misalignment data for the component is excluded from the calculation of calibration data in processing for the abovementioned calculation.
Inventors:
NAGAYA TOSHIHIKO
KITA TAKAYUKI
KIHARA MASAHIRO
TANIGUCHI MASAHIRO
KITA TAKAYUKI
KIHARA MASAHIRO
TANIGUCHI MASAHIRO
Application Number:
PCT/JP2020/022604
Publication Date:
April 01, 2021
Filing Date:
June 09, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/04; H05K13/08
Foreign References:
| JP2016058603A | 2016-04-21 | |||
| JP2002134899A | 2002-05-10 | |||
| JP2018113336A | 2018-07-19 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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