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Patent Searching and Data


Title:
MOUNTING DEVICE AND FILM SUPPLYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/207858
Kind Code:
A1
Abstract:
A mounting device (10) is configured to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting device comprises: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding such that new film is arranged on the bottom surface of the mounting head each time an electronic component is mounted; a tension detecting unit (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control unit (20) that causes the winding reel (26) to be rotated by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting unit (38). Due to this configuration, a desired tension can be generated in the film on the bottom surface of the mounting head.

Inventors:
NOGUCHI, Yuichiro (51-1 Inadaira 2-chome, Musashimurayama-sh, Tokyo 85, 〒2088585, JP)
NOMURA, Katsutoshi (51-1 Inadaira 2-chome, Musashimurayama-sh, Tokyo 85, 〒2088585, JP)
Application Number:
JP2019/001627
Publication Date:
October 31, 2019
Filing Date:
January 21, 2019
Export Citation:
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Assignee:
SHINKAWA LTD. (51-1, Inadaira 2-chome Musashimurayama-sh, Tokyo 85, 〒2088585, JP)
International Classes:
H01L21/60; B65H23/198
Foreign References:
JP2017123423A2017-07-13
JP2015035493A2015-02-19
JPS58135051A1983-08-11
JP2006261343A2006-09-28
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (1-34-12, Kichijoji-Honcho Musashino-sh, Tokyo 04, 〒1800004, JP)
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