MOUNTING DEVICE, INFORATION PROCESSING DEVICE, AND MOUNTING METHOD

Title:

MOUNTING DEVICE, INFORATION PROCESSING DEVICE, AND MOUNTING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/175974

Kind Code:

A1

Abstract:

A mounting device, provided with: a mounting head having a collection member for collecting a component, the mounting head collecting a component by means of the collection member from a feed unit having a holding member that holds the component, moving the component, and disposing the component at a prescribed disposing position; an imaging unit for imaging the component held by the mounting head; and a control unit for executing a first disposing process to cause the mounting head to collect the component and to dispose the component at the disposing position upon correcting a positional deviation using an imaging result obtained by the imaging of the component by the imaging unit, and, when the positional deviation is within a prescribed allowable range, executing a second disposing process to cause the mounting head to dispose the component at the disposing position without the mounting head performing the imaging process by means of the imaging unit.

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JP5930599	Electronic component mounting method and mounting device
JPH04286200	MOUNTING METHOD FOR ELECTRONIC PART
WO/2018/100717	MANUFACTURING MANAGEMENT SYSTEM FOR COMPONENT MOUNTING LINE

Inventors:

BABA KOSEI (JP)
NAITO SHINJI (JP)

Application Number:

PCT/JP2018/009767

Publication Date:

September 19, 2019

Filing Date:

March 13, 2018

Export Citation:

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Assignee:

FUJI CORP (JP)

International Classes:

H05K13/08; H05K13/04

Domestic Patent References:

WO2016020975A1

2016-02-11

Foreign References:

JP2010135463A	2010-06-17
JPH0537194A	1993-02-12
JP2007027213A	2007-02-01
JP2005175307A	2005-06-30
JP2015211187A	2015-11-24

Other References: