Title:
MOUNTING DEVICE, MOUNTING METHOD, AND MOUNTING CONTROL PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/089660
Kind Code:
A1
Abstract:
This mounting device derives, for each assumed placement height of a laminated mounting body in an expected placement region, a calibration value for calibrating the difference between coordinate values calculated on the basis of an overhead-view image and coordinate values calculated on the basis of an upward-view image. A calibration control unit computes the calibration value on the basis of the overhead-view image and the upward-view image, which are outputted once a calibration indicator disposed to match a placement height is imaged by an upward-view-imaging unit and an overhead-view-imaging unit that employs a Scheimpflug optical system. A mounting control unit adjusts the position of a mounting tool such that an expected contact surface of the mounting body reaches the placement height, recognizes a reference position on the basis of the upward-view image captured by the upward-view-imaging unit, adjusts the position of the overhead-view-imaging unit such that a focal-point surface is at the same plane as the placement height, and recognizes a target position on the basis of the overhead-view image in which the expected placement region is captured by the overhead-view-imaging unit and the calibration value that corresponds to the placement height.
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Inventors:
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2021/042065
Publication Date:
May 25, 2023
Filing Date:
November 16, 2021
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2015190471A1 | 2015-12-17 |
Foreign References:
| JP2016092094A | 2016-05-23 | |||
| JP2010238974A | 2010-10-21 | |||
| JPH01183339A | 1989-07-21 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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