Title:
MOUNTING DEVICE AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/003519
Kind Code:
A1
Abstract:
Provided is a mounting device that, when performing thermocompression bonding of a semiconductor chip that is temporarily fixed to a substrate such as a silicon wafer, etc., is able to perform thermocompression bonding under uniform conditions until reaching the semiconductor chip that is temporarily fixed near the substrate outer peripheral part. In specific terms, provided is a mounting device that is provided with: a bonding head that has a pressure surface for pressing the semiconductor chip on the substrate; a backup stage that supports the region pressed by the pressing surface from the back surface of the substrate; and a substrate gripping means that uses a holding part to partially grip the peripheral edge part of the substrate, the mounting device having a function of changing the position of the holding part by which the substrate gripping means grips the substrate.
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Inventors:
TERADA KATSUMI (JP)
SENDA MASAFUMI (JP)
MASHIMO YUKI (JP)
SENDA MASAFUMI (JP)
MASHIMO YUKI (JP)
Application Number:
PCT/JP2017/022117
Publication Date:
January 04, 2018
Filing Date:
June 15, 2017
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| JP2009267413A | 2009-11-12 |
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