Title:
MOUNTING DEVICE, MOUNTING SYSTEM, AND SETTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/032073
Kind Code:
A1
Abstract:
This mounting device comprises a component supply unit and a mounting unit. The component supply unit supplies components from a holding member that holds a plurality of components. The mounting unit has a collection member that collects components from the component supply unit. The mounting unit can collect components at a plurality of collection heights. Within a prescribed short-term component count range, the mounting device makes the mounting unit collect components at a prescribed collection height and performs prescribed allowance determination. When a collection error count has exceeded a prescribed allowed count, the mounting device performs modification processing that repeatedly modifies the collection height of the mounting unit using a short-term offset value for adjusting the collection height. On the basis of the results of the modification processing, the mounting device performs short-term evaluation setting processing that sets the collection height.
Inventors:
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2021/032112
Publication Date:
March 09, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00; H05K13/04
Domestic Patent References:
| WO2013145228A1 | 2013-10-03 |
Foreign References:
| JPH0983198A | 1997-03-28 | |||
| JP2003060394A | 2003-02-28 | |||
| JPH05198977A | 1993-08-06 | |||
| JP6248286B2 | 2017-12-20 | |||
| JP6076047B2 | 2017-02-08 | |||
| US20170166407A1 | 2017-06-15 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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