Title:
MOUNTING HEAD
Document Type and Number:
WIPO Patent Application WO/2018/092883
Kind Code:
A1
Abstract:
A mounting device is provided with: an attachment (10) including a surface (14) for attachment of a semiconductor die (70); a heater (20) which is disposed on a side of the attachment (10) opposite from the surface (14), and which heats the semiconductor die (70) attached to the surface (14); a suction hole which penetrates through the attachment (10) and the heater (20) integrally, and which opens in the surface (14); and a body portion which is disposed on a side of the heater (20) opposite from the attachment (10), and which includes a vacuum suction path (32) in communication with the suction hole. The vacuum suction path (32) includes a storage portion (90) in which a foreign matter comprising a liquid formed by condensation of gas suctioned from the suction hole, or a solid formed by solidification of the liquid is stored. In this way, fouling of a mounting head can be inhibited.
Inventors:
NISHIDE MANATO (JP)
SEYAMA KOHEI (JP)
HAYASHI HIJIRI (JP)
SEYAMA KOHEI (JP)
HAYASHI HIJIRI (JP)
Application Number:
PCT/JP2017/041484
Publication Date:
May 24, 2018
Filing Date:
November 17, 2017
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H05K13/04; H01L21/60
Domestic Patent References:
| WO2012165313A1 | 2012-12-06 |
Foreign References:
| JP2011086699A | 2011-04-28 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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