Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOUNTING METHOD AND MOUNTING DEVICE FOR SEMICONDUCTOR ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2019/207920
Kind Code:
A1
Abstract:
This mounting method for semiconductor elements includes: (1) a step for arranging semiconductor elements on a first substrate via an adhesive layer that includes at least a laser-degradable adhesive layer; (2) a step for radiating laser light at the laser-degradable adhesive layer from the first substrate side; (3) a step for making a carrier member hold the semiconductor elements and thereby picking the semiconductor elements off the first substrate; and (4) a step for mounting the picked-off semiconductor elements on a second substrate.

More Like This:
JP7333712Electrostatic chuck, support table and plasma processing equipment
WO/2013/049476CONTROLLED SURFACE ROUGHNESS IN VACUUM RETENTION
WO/2008/138725APPARATUS AND METHOD FOR ULTRASONIC WET TREATMENT OF PLATE-LIKE ARTICLES
Inventors:
ISHII HIROYUKI (JP)
MIZUNO HIKARU (JP)
OOKITA KENZOU (JP)
Application Number:
PCT/JP2019/005756
Publication Date:
October 31, 2019
Filing Date:
February 18, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JSR CORP (JP)
International Classes:
H01L21/683; H01L21/60; H01L33/62
Domestic Patent References:
WO2016158264A12016-10-06
Foreign References:
US20160144608A12016-05-26
JP2010251359A2010-11-04
JP2002314053A2002-10-25
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DISPLAY MEDIATION CONTROL EVALUATION DEVICE AND EVALUATION METHOD, AND RULE DEFINITION FILE GENERATI...

Next Patent: METHOD FOR TESTING FOR TISSUE-SPECIFIC CELL DAMAGE