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Title:
MOUNTING METHOD, MOUNTING HEAD, AND MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/221350
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technology enabling to improve mounting efficiency. As a means for solving the problem, a sheet (22) having a component (21) adhered thereto is held by having a space between the sheet (22) and a substrate (20). Then, the sheet (22) is warped and the component (21) is brought into contact with the substrate (20) by pressing, via the sheet (22), the component (21) by means of a plunger (31). Then, a pin (32) relatively protrudes from the plunger (31) by moving the plunger (31) to the inner side of a mounting head (10).

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Inventors:
TATSUIWA TSUYOSHI (JP)
Application Number:
PCT/JP2016/068526
Publication Date:
December 28, 2017
Filing Date:
June 22, 2016
Export Citation:
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Assignee:
SUZUKI CO LTD (JP)
International Classes:
H05K13/02; H01L21/52; H05K13/04
Foreign References:
JPS6430235A1989-02-01
JP2010040657A2010-02-18
JPH0927418A1997-01-28
JPS6063940A1985-04-12
JP2008535275A2008-08-28
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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