Title:
MOUNTING METHOD OF SURFACE ACOUSTIC WAVE ELEMENT AND SURFACE ACOUSTIC WAVE DEVICE HAVING RESIN−SEALED SURFACE ACOUSTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2003/084061
Kind Code:
A1
Abstract:
A surface acoustic wave device which can be made thin (low profile) and in which a surface acoustic wave element can be protected against thermal breakdown by shortening the heating process. The surface acoustic wave device comprises a substrate, a surface acoustic wave element having a comb type electrode formed on a piezoelectric substrate and flip−chip mounted on the substrate through bumps such that the comb type electrode faces the substrate, a first resin layer covering the surface acoustic wave element, and a second resin layer formed on the first resin layer, wherein the first resin layer and the second resin layer are composed of thermosetting resin making a state transition of setting after softening in the heating process, and first resin layer is formed of a resin material exhibiting higher fluidity through softening as compared with the second resin layer.
Inventors:
MIYAJI NAOMI (JP)
Application Number:
PCT/JP2002/013421
Publication Date:
October 09, 2003
Filing Date:
December 24, 2002
Export Citation:
Assignee:
FUJITSU MEDIA DEVICES LTD (JP)
MIYAJI NAOMI (JP)
MIYAJI NAOMI (JP)
International Classes:
H03H9/25; H03H3/08; H03H3/10; (IPC1-7): H03H9/25; H03H3/08
Foreign References:
| JPH08204497A | 1996-08-09 | |||
| JPH11251866A | 1999-09-17 | |||
| JPH11150440A | 1999-06-02 | |||
| JPH1117490A | 1999-01-22 | |||
| JPH06204293A | 1994-07-22 | |||
| JP2001168220A | 2001-06-22 | |||
| JPH11214955A | 1999-08-06 | |||
| JPH10321666A | 1998-12-04 |
Other References:
See also references of EP 1492231A4
Attorney, Agent or Firm:
Hayashi, Tsunenori (DOI & ASSOCIATES Toshou-Bldg. No. 3,
3-9-5, Shin-Yokohama, Kohoku-k, Yokohama-shi Kanagawa, JP)
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