Title:
MOUNTING-RELATED PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND PROGRAM FOR SAME
Document Type and Number:
WIPO Patent Application WO/2016/110941
Kind Code:
A1
Abstract:
A mounting device 11 of the present invention captures an image relating to the state of a component; extracts from the captured image the contours of the component present within a prescribed detection area; and on the basis of information relating to the extracted contours of the component, moves a prescribed pickup area that includes an image of the component to a position at which the image of the component is situated therein, and outputs image data included in the pickup area. With this mounting device 11, even when a component has shifted out of position in the captured image, for example, the pickup area is moved in accordance with the extracted contours of the component, and therefore the pickup area can be smaller.
Inventors:
ESAKI HIROTAKE (JP)
Application Number:
PCT/JP2015/050099
Publication Date:
July 14, 2016
Filing Date:
January 06, 2015
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H04N5/225; H04N5/232; H05K13/08
Foreign References:
| JP2012028949A | 2012-02-09 | |||
| JP5524495B2 | 2014-06-18 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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