Title:
MOUNTING STRUCTURE OF PACKAGED LED AND LED ILLUMINATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2011/160592
Kind Code:
A1
Abstract:
A mounting structure of packaged LED comprises a packaged LED (1) and a radiator or housing (7). The LED (1) is directly soldered on the radiator or housing (7), so that the LED (1) can be in direct contact with the radiator or housing (7). Consequently, the heat-dissipating effect of the LED is enhanced, the luminosity of the LED is increased, and the service life of the LED is prolonged. The mounting structure of packaged LED can be applied to an LED illumination system.
Inventors:
WU, Sau Mui (6th Floor, Block B Sunview Industrial Building,3 On Yip Street, Chai Wan, Hong Kong, Kong, CN)
Application Number:
CN2011/076177
Publication Date:
December 29, 2011
Filing Date:
June 23, 2011
Export Citation:
Assignee:
WU, Sau Mui (6th Floor, Block B Sunview Industrial Building,3 On Yip Street, Chai Wan, Hong Kong, Kong, CN)
International Classes:
F21V29/00; F21V19/00; F21Y101/02
Attorney, Agent or Firm:
DHC LAW OFFICE (Suite 2201, Modern International Commercial BuildingCross of Fuhua Road and Jintian Road, Futian Distric, Shenzhen Guangdong 8, 518048, CN)
Claims: