Title:
MOUNTING STRUCTURE FOR PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2008/001462
Kind Code:
A1
Abstract:
A mounting structure for a printed board, where, when the printed board on which
components are mounted is fixed to a fixed structure such as a housing, mechanical
stress in solder joints of components soldered on the printed substrate is mitigated
and where the space of the printed board can be effectively used to adapt the board
to high density mounting. The mounting structure has cushioning sections (20,
22, 24) near the vicinity of fixation holes (14) for fixing the printed board (10)
to the fixed structure. The cushioning sections are formed as slits or grooves
and absorb stress caused by the fixing.
Inventors:
HIRANO, Yoshikazu (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 2118588, JP)
Application Number:
JP2006/313108
Publication Date:
January 03, 2008
Filing Date:
June 30, 2006
Export Citation:
Assignee:
FUJITSU LIMITED (1-1 Kamikodanaka 4-chome, Nakahara-ku Kawasaki-sh, Kanagawa 88, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
富士通株式会社 (〒88 神奈川県川崎市中原区上小田中４丁目１番１号 Kanagawa, 2118588, JP)
International Classes:
H05K1/02
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg.5-1, Toranomon 3-chom, Minato-ku Tokyo, 105-8423, JP)
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