Title:
MOUNTING STRUCTURE FOR TEMPERATURE-SENSITIVE FUSE ON CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/1999/060828
Kind Code:
A1
Abstract:
Electronic parts are mounted on a circuit board (1) on which interconnection patterns are formed. Of those parts, particular field-effect transistors (FET) (2) that are likely to become hot are adjacent to a temperature-sensitive fuse (4) that breaks a circuit when the temperature of the electronic part rises. The circuit board (1) includes A through hole (1a) in the area where the FETs (2) are mounted. The FETs (2) are laid over the through hole (1a) on the front side of the circuit board (1). The temperature-sensitive fuse (4) is partially inserted in the through hole (1a) on the backside of the FETs (2), which is filled with heat-conducting resin (3) such as silicone. This circuit board can be thin, including parts mounted on it, without using a thinner board. Therefore, such a board with a temperature-sensitive fuse can be used in notebook computers that usually have only a limited space. This circuit board also provides a mounting structure for a temperature-sensitive fuse that is sensitive to the temperature of parts to break circuits if abnormal temperature is detected.
Inventors:
Nagashima, Mitsunori (Rohm Co, Ltd. 21, Saiin Mizosaki-cho Ukyo-ku Kyoto-shi Kyoto, 615-8585, JP)
Application Number:
PCT/JP1999/002360
Publication Date:
November 25, 1999
Filing Date:
April 30, 1999
Export Citation:
Assignee:
ROHM CO., LTD. (21 Saiin Mizosaki-cho Ukyo-ku Kyoto-shi Kyoto, 615-8585, JP)
Nagashima, Mitsunori (Rohm Co, Ltd. 21, Saiin Mizosaki-cho Ukyo-ku Kyoto-shi Kyoto, 615-8585, JP)
Nagashima, Mitsunori (Rohm Co, Ltd. 21, Saiin Mizosaki-cho Ukyo-ku Kyoto-shi Kyoto, 615-8585, JP)
International Classes:
H05K7/20; H01H37/04; H05K1/02; H05K1/18; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Fukami, Hisao (Sumitomo Bank Minamimori-machi Building 1-29, Minamimori-machi 2-chome Kita-ku Osaka-shi Osaka, 530-0054, JP)
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