Title:
MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/117923
Kind Code:
A1
Abstract:
A mounting structure for mounting the outer wall (21) of a metallic chassis (20) to the inner wall (11) of a resinous panel (10). Backings (13-16) are provided to the inner wall (11) of the panel (10) at positions separated from corners (12) on which stress concentrates, and the chassis (20) is made to be in partial contact with the backings. The configuration prevents the occurrence of cracks in the corners (12) due to thermal contraction.
Inventors:
HIROTA HIDEYUKI (JP)
YOSHIZAWA JIRO (JP)
KANAMARU MASAHIRO (JP)
YOSHIZAWA JIRO (JP)
KANAMARU MASAHIRO (JP)
Application Number:
PCT/JP2010/002115
Publication Date:
September 29, 2011
Filing Date:
March 25, 2010
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
HIROTA HIDEYUKI (JP)
YOSHIZAWA JIRO (JP)
KANAMARU MASAHIRO (JP)
HIROTA HIDEYUKI (JP)
YOSHIZAWA JIRO (JP)
KANAMARU MASAHIRO (JP)
International Classes:
H05K5/02; H05K7/14
Foreign References:
| JPS58193679U | 1983-12-23 | |||
| JPS6142887U | 1986-03-19 | |||
| JPH038396A | 1991-01-16 | |||
| JPH1117353A | 1999-01-22 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
Hideaki Tazawa (JP)
Hideaki Tazawa (JP)
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Claims:
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