Title:
MOUNTING SUBSTRATE, WAVEGUIDE MODULE, INTEGRATED CIRCUIT-MOUNTED SUBSTRATE, MICROWAVE MODULE
Document Type and Number:
WIPO Patent Application WO/2017/188317
Kind Code:
A1
Abstract:
A mounting substrate or the like is provided that can reduce losses in a waveguide extending from a microwave IC to a transmission/reception antenna. A mounting substrate includes a circuit board and a coupler. The circuit board has a mounting surface on which a microwave integrated circuit element is to be mounted, the microwave integrated circuit element having a plurality of terminals including first and second antenna I/O terminals. The coupler connects the first and second antenna I/O terminals to a waveguide device. The coupler includes: a first electrical conductor portion to be connected to the first antenna I/O terminal; a second electrical conductor portion to be connected to the second antenna I/O terminal; and an elongated gap in which an end face of the first electrical conductor portion and an end face of the second electrical conductor portion oppose each other. The elongated gap has a narrow portion at which the distance between the end face of the first electrical conductor portion and the end face of the second electrical conductor portion is locally decreased. The coupler couples an electromagnetic field being produced at the narrow portion to a waveguide in the waveguide device.
Inventors:
KIRINO HIDEKI (JP)
KAMO HIROYUKI (JP)
KAMO HIROYUKI (JP)
Application Number:
PCT/JP2017/016557
Publication Date:
November 02, 2017
Filing Date:
April 26, 2017
Export Citation:
Assignee:
NIDEC ELESYS CORP (JP)
WGR CO LTD (JP)
WGR CO LTD (JP)
International Classes:
H01P5/08; H01P3/123
Foreign References:
| JP2011155586A | 2011-08-11 | |||
| US20080129408A1 | 2008-06-05 | |||
| JP2005039414A | 2005-02-10 | |||
| US20030117245A1 | 2003-06-26 |
Other References:
KIRINO ET AL.: "A 76 GHz Multi-Layered Phased Array Antenna Using a Non-Metal Contact Metamaterial Waveguide", IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, vol. 60, no. 2, February 2012 (2012-02-01), XP011403559
Attorney, Agent or Firm:
OKUDA Seiji (JP)
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