Title:
MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/053897
Kind Code:
A1
Abstract:
This mounting system is provided with a component mounting device for mounting a component on a surface of a substrate, and a control device. The surface of the substrate includes a mounting planned portion in which the component is planned to be mounted by means of the component mounting device. The component mounting device is provided with an image capture device for capturing an image of the surface of the substrate, and is configured to mount the component in the mounting planned portion when the mounting planned portion of the surface of the substrate is present in a predetermined position. The control device stores drawing information in which the surface of the substrate on which the component is to be mounted by means of the component mounting device is drawn. The control device compares a specific position in the drawing information that is stored with the specific position in image information relating to the surface of the substrate captured by means of the image capture device, and, if the specific positions differ, recognizes that the mounting planned portion of the surface of the substrate is not present in the predetermined position.
Inventors:
HARA KENJI (JP)
Application Number:
PCT/JP2017/033579
Publication Date:
March 21, 2019
Filing Date:
September 15, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K13/08
Foreign References:
| JP2010123906A | 2010-06-03 | |||
| JP2006135158A | 2006-05-25 | |||
| JP2016042524A | 2016-03-31 | |||
| US20160091869A1 | 2016-03-31 | |||
| JP2003069288A | 2003-03-07 |
Other References:
See also references of EP 3684157A4
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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