Title:
MOV ASSEMBLY HAVING INSULATING BEARING PLATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/152756
Kind Code:
A1
Abstract:
An MOV assembly having an insulating bearing plate structure, comprising at least two electrode sheets (2, 4) and at least one MOV chip (3). An MOV chip (3) is sandwiched between each two adjacent electrode sheets (2, 4); an insulating bearing plate (1) is provided outside one of the two outer electrode sheets (2, 4), and the other electrode sheet and the insulating bearing plate (1) are fixed by means of a fastening piece, or the insulating bearing plate (1) is separately provided outside the two outer electrode sheets (2, 4), and the two insulating bearing plates (1) are fixed by means of a fastening piece. The MOV assembly is free of high-temperature damage, is strong in overvoltage tolerance, is low in costs, and is easy to manufacture. By providing a single insulating bearing plate (1) or dual insulating bearing plates (1) outside the electrode sheets (2, 4), the insulativity and the mechanical strength of the MOV assembly are improved. By coating an insulating layer outside the MOV assembly, the MOV assembly can be used as a conventional varistor. The insulating bearing plate (1) is provided so that heat is led out from the middle, thermal dissociation is more convenient, and the release reliability is improved.
Inventors:
CHEN ZETONG (CN)
TSENG CHING-LUNG (TW)
TSENG CHING-LUNG (TW)
Application Number:
PCT/CN2017/074661
Publication Date:
August 30, 2018
Filing Date:
February 24, 2017
Export Citation:
Assignee:
LONGKE ELECTRONICS HUIYANG CO LTD (CN)
International Classes:
H02H9/04; H01C7/108
Foreign References:
| CN106782957A | 2017-05-31 | |||
| CN206194472U | 2017-05-24 | |||
| CN105610139A | 2016-05-25 | |||
| CN205489503U | 2016-08-17 | |||
| CN203070854U | 2013-07-17 | |||
| US6304166B1 | 2001-10-16 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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