Title:
MOVABLE JIG FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/156794
Kind Code:
A1
Abstract:
When minute electronic chip components were stored/fixed in electronic chip component trays and machined or processed, in addition to being extremely small, many were hard and brittle and were easily damaged. Moreover, it was extremely difficult to manufacture trays capable of storing/fixing the minute electronic chip components in electronic chip component insertion sections in a form in which the side surface of a long side or a short side of the electronic chip component was facing upward. The present invention relates to a method for manufacturing electronic chip component trays by: stacking a second metal sheet, on which a frame plate is formed, on a first metal sheet, on which a bottom surface plate is formed; mounting a movable plate in the movable plate insertion section of the frame plate; stacking a third metal sheet on which a cover plate is formed; and welding the bottom surface plate, the frame plate and the cover plate by spot welding in multiple places.
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Inventors:
TANAKA AKIRA (JP)
MORIYA TAKAMARO (JP)
MORIYA TAKAMARO (JP)
Application Number:
PCT/JP2014/057224
Publication Date:
October 02, 2014
Filing Date:
March 18, 2014
Export Citation:
Assignee:
NIPPON FILCON KK (JP)
International Classes:
B65D85/86; H01L21/673; H01L21/683
Foreign References:
| JPH11220014A | 1999-08-10 | |||
| JP2009139633A | 2009-06-25 | |||
| JP2011037518A | 2011-02-24 |
Attorney, Agent or Firm:
UBUKATA Kazuo (JP)
産 form Kazuhisa (JP)
産 form Kazuhisa (JP)
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